Technologies: Cleaning Solution

Plasma cleaning (Dry Cleaning Technology)

A method used to clean and prepare surfaces for various applications in industries such as electronics, aerospace, medical, and more. Unlike traditional wet cleaning methods that use solvents or chemicals, plasma cleaning relies on the use of ionized gases to remove contaminants and improve surface properties.

How does it works:

  1. Generation of Plasma: Plasma is the fourth state of matter, in addition to solid, liquid, and gas. It consists of charged particles (ions and electrons) that are highly reactive. In a plasma cleaning system, a low-pressure gas (usually an inert gas like argon, but sometimes reactive gases like oxygen or hydrogen) is introduced into a chamber.
  2. Ionization: The gas in the chamber is ionized by applying a high-frequency electrical field. This ionization process creates a mixture of positive ions, electrons, and neutral atoms or molecules.
  3. Chemical Reactions: The energetic ions and electrons in the plasma collide with the gas molecules and generate a variety of reactive species, such as free radicals, ions, and excited atoms. These species are highly effective at breaking chemical bonds on the surface being cleaned.
  4. Contaminant Removal: When the plasma comes into contact with the surface to be cleaned, the reactive species bombard the contaminants (such as organic residues, oils, particles, etc.), breaking them down into smaller, less adhesive molecules. These smaller molecules are then removed from the surface carried away by the vacuum pump.
  5. Surface Activation: In addition to cleaning, plasma treatment can also activate surfaces. This means it can change the surface energy and improve adhesion for processes like bonding, coating, or printing.

Advantages of plasma dry cleaning:

  1. No Chemical Residue: Since plasma cleaning doesn’t involve the use of liquid solvents or chemicals, there is no residue left behind on the cleaned surface. This is especially important in industries like electronics, where even tiny amounts of residue can cause problems.
  2. Selective Cleaning: Plasma cleaning can be highly selective, targeting specific contaminants without affecting the bulk material. This is crucial for delicate or sensitive materials that may be damaged by traditional wet cleaning methods.
  3. High Precision and Uniformity: Plasma cleaning offers precise control over the cleaning process, allowing for consistent and uniform results across large or complex surfaces.
  4. Applicability to a Wide Range of Materials: Plasma cleaning is versatile and can be used on a wide variety of materials, including metals, ceramics, plastics, and semiconductors.
  5. Suitability for Delicate Components: It is well-suited for cleaning delicate components like optical lenses, microelectromechanical systems (MEMS), and electronic devices, where wet cleaning might not be feasible or may cause damage.
  6. Reduced Environmental Impact: Because it doesn’t use harsh chemicals, plasma cleaning is considered more environmentally friendly compared to some other cleaning methods.

O2 Plasma Cleaning Services

Reactive species in oxygen (O2) plasma include oxygen ions (O+ and O2+), oxygen radicals (O, O2, O3), and excited oxygen states.

  • Oxygen Ions (O+ and O2+): Positively charged due to electron loss. They react with other species, causing material removal in plasma etching.
  • Oxygen Radicals (O, O2, O3): Contain unpaired electrons and react aggressively, breaking chemical bonds. In O2 plasma, they aid in breaking down contaminants during cleaning.
  • Excited Oxygen States: Oxygen species in excited states. Transferring energy during collisions with other species and emit UV photons upon returning to lower energy levels. This UV light interacts with oxygen molecules in the surrounding air, producing ozone (O3).


  • Power: 600 Watts
  • Chamber size: W: 310mm, L: 310mm, H: 310mm

Collaborative R&D: Unlocking the Future Potential of Plasma Technology in Partnership with Clients

Different gases yield varying effects:

Oxygen (O2): Removes organic contaminants via oxidative reactions.
Argon (Ar): Physically dislodges particles from surfaces.
Hydrogen (H2): Reduces metal oxides and activates surfaces.
Nitrogen (N2): Enhances wettability, modifies surfaces.
Fluorine Gases (CF4, SF6, NF3, etc.): Etches and removes materials via chemical reactions.
Helium (He): Inert carrier gas, aids in distribution.

Effects depend on surface, contaminants, plasma energy, and duration. Experimentation, research and development are required to determine the optimal gas and conditions for specific cleaning needs.

Potential Future Applications

Semiconductor Manufacturing:

  • Wafer photoresist removal.
  • Surface activation for film deposition.

Biomedical & Medical Devices:

  • Implant cleaning and sterilization.
  • Medical instrument residue removal.

Aerospace & Aviation:

  • Aircraft surface depainting.
  • Engine component coating removal.

Electronics Assembly:

  • Circuit board flux residue cleaning.
  • Surface activation for bonding.

Optics & Photonics:

  • Optical component cleaning.
  • Mirror and lens modification.

Automotive Industry:

  • Paint adhesion surface prep.
  • Engine part cleaning.

Textile Industry:

  • Fiber surface modification.
  • Textile activation before printing.

Renewable Energy:

  • Solar panel surface cleaning.
  • Fuel cell component treatment.

MEMS (Micro-Electro-Mechanical Systems):

  • Microchip structure cleaning.
  • Microfluidic device activation.

Glass & Ceramics Industry:

  • Glass surface activation.
  • Ceramic substrate cleaning.
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